Materion understands how critical the integrity of bond between target and backing plate is. Not only for good thermal transfer, but also vacuum integrity and process conditions rely on a proper bond. Materion utilizes multiple target bonding methods, including solder bonding, diffusion bonding and additional methods of high temperature bonding.
Materion provides Epoxy bonding as a service, and as a product for sale. See Silvertech PT 1 Epoxy data sheet.
We also have the capability to ultrasonically inspect the quality of bond layers.
We have full service target bonding facilities in Brewster NY, Buffalo NY, Santa Clara CA, Limerick Ireland and Taiwan.
A partial list of equipment platforms we routinely bond for includes:
• Applied Materials
• Novellus
• Trikon
• Aviza
• Anelva
• Veeco
• CVC
• NEXX
• Singulus
• Unaxis
• SFI
• KDF
With world-wide sales and manufacturing, contact your local Materion representative.